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UID:DSC-22741
DTSTART;TZID=Europe/Berlin:20260618T130000
SEQUENCE:1780200684
TRANSP:OPAQUE
DTEND;TZID=Europe/Berlin:20260618T150000
URL:https://www.dresden-science-calendar.de/calendar/en/detail/22741
LOCATION:TUD Materials Science - HAL\, Hallwachsstraße 301069 Dresden
SUMMARY:Hofmann: Carrier Transport Through Engineered Nanostructure Interfa
 ces as a Platform for Future Electronics
CLASS:PUBLIC
DESCRIPTION:Speaker: Mario Hofmann\nInstitute of Speaker: Department of Phy
 sics National Taiwan University Taipei\, Taiwan\nTopics:\nMaterialien\n Lo
 cation:\n  Name: TUD Materials Science - HAL (HAL Bürogebäude - 115)\n  
 Street: Hallwachsstraße 3\n  City: 01069 Dresden\n  Phone: \n  Fax: \nDes
 cription: Future electronics must not only surpass current technologies in
  performance (\"More-Moore\")\, but also deliver enhanced functionality\, 
 ubiquitous integration\, and energy efficiency (\"More-than-Moore\"). Nano
 structured materials offer unique opportunities toward this vision due to 
 their tunable electronic structure and scalable\, low-cost processing from
  abundant materials. However\, their integration into functional devices r
 emains challenging because\, at the nanoscale\, interfaces dominate carrie
 r transport rather than bulk electronic properties.&amp\;#13\; In this tal
 k\, I will present our recent advances in engineering nanostructure interf
 aces to control carrier transport. &amp\;#13\; First\, to obtain fundament
 al insight into nanoscale transport\, we developed a method to create ultr
 aclean two-dimensional interfaces. This platform enables precise character
 ization of spin transport and has led to magnetic tunnel junctions with re
 cord-level performance and energy efficiency. In addition\, we demonstrate
  spin-filtering effects in 2D heterojunctions\, opening new pathways towar
 d spintronic computing architectures.&amp\;#13\; Beyond atomically sharp 2
 D heterointerfaces\, we further engineer transport by transforming assembl
 ies of nanostructures into continuous interfacial systems. Specifically\, 
 we introduce a strategy to sinter perovskite nanocubes into extended\, fre
 estanding membranes\, where controlled coalescence reduces interparticle b
 arriers and enhances both electronic transport and mechanical robustness.&
 amp\;#13\; Finally\, we address a regime in which transport is no longer d
 etermined by a single interface\, but by networks of many coupled interfac
 es. In such assemblies\, carrier flow depends on collective phenomena such
  as percolation pathways\, interparticle coupling\, and mechanical jamming
 \, which fundamentally alter electronic and mechanical response. Using new
 ly developed simulation tools\, we analyze how structural rearrangements m
 odify transport. The gained insight enables novel application directions a
 nd I will describe our work on strain sensing\, microrobotics\, and hot el
 ectron catalysis.
DTSTAMP:20260601T051403Z
CREATED:20260306T064028Z
LAST-MODIFIED:20260531T041124Z
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