The Future of Heterogeneous Integration – Challenges & Opportunities
- Date
- Sep 27, 2023
- Time
- 4:30 PM - 5:30 PM
- Speaker
- Prof. Madhavan Swaminathan
- Affiliation
- The Pennsylvania State University, USA
- Language
- en
- Main Topic
- Informatik
- Description
- <p><strong>Abstract</strong><br>The global semiconductor industry is projected to become a trillion-dollar industry by 2030. This is historic considering that it took the industry 55 years to reach half a trillion dollars in size and will take just another 10 years to double in size to a trillion dollars. Advanced packaging is expected to play an important role in making this happen.<br>So, what are the key drivers, where are the challenges and what are the innovations necessary in advanced packaging over the next decade and beyond to be able to support heterogeneous integration? Why is semiconductor packaging becoming so important? These questions will be addressed in the context of emerging applications.</p>
Last modified: Sep 27, 2023, 7:42:08 AM
Location
TUD
- Homepage
- https://navigator.tu-dresden.de/
Organizer
cfaed - Center for Advancing Electronics DresdenBarkhausen Building II/7b, Georg-Schumann-Str.1101187Dresden
- Phone
- +49 351 463-41000
- Fax
- +49 351 463-41099
- TUD cfaed
- Homepage
- http://www.cfaed.de/
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