The specific grain boundary resistivity of Ni and Cu metals

Dec 11, 2019
1:30 PM - 2:30 PM
Prof. Imre Bakonyi
Wigner Research Centre for Physics, Hungarian Academy of Sciences
Main Topic
Ines Firlle
In order to derive a reliable value for the specific grain-boundary resistivity SGBR of Ni metal, a study of the room-temperature electrical resistivity of nanocrystalline (nc) Ni metal samples produced by electrodeposition with various grain sizes was carried out. These resistivity data were compared with previous reports on nc-Ni and all results were analyzed according to the procedure of Andrews who found for bulk polycrystalline Cu that the resistivity increment due to grain boundaries is proportional to the grain-boundary surface area per unit volume which is, on the other hand, inversely proportional to the grain size. It is pointed out in our study that the grain size directly accessible by transmission electron microscopy (TEM) imaging is the relevant parameter for the evaluation of SGBR. This is because the crystallite size deduced from X-ray diffraction (XRD) line broadening leads to an underestimation of SGBR since coherency-breaking intragrain defects such as small-angle grain boundaries and twin boundaries which do not contribute significantly to the resistivity also cause an XRD line broadening.

Last modified: Dec 6, 2019, 12:05:30 AM


Leibniz Institut für Festkörper- und Werkstoffforschung Dresden (D2E.27, IFW Dresden)Helmholtzstraße2001069Dresden


Leibniz Institut für Festkörper- und Werkstoffforschung DresdenHelmholtzstraße2001069Dresden
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