BEGIN:VCALENDAR
VERSION:2.0
PRODID:www.dresden-science-calendar.de
METHOD:PUBLISH
CALSCALE:GREGORIAN
X-MICROSOFT-CALSCALE:GREGORIAN
X-WR-TIMEZONE:Europe/Berlin
BEGIN:VTIMEZONE
TZID:Europe/Berlin
X-LIC-LOCATION:Europe/Berlin
BEGIN:DAYLIGHT
TZNAME:CEST
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
DTSTART:19810329T030000
RRULE:FREQ=YEARLY;INTERVAL=1;BYMONTH=3;BYDAY=-1SU
END:DAYLIGHT
BEGIN:STANDARD
TZNAME:CET
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
DTSTART:19961027T030000
RRULE:FREQ=YEARLY;INTERVAL=1;BYMONTH=10;BYDAY=-1SU
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
UID:DSC-22668
DTSTART;TZID=Europe/Berlin:20260402T133000
SEQUENCE:1775626588
TRANSP:OPAQUE
DTEND;TZID=Europe/Berlin:20260402T153000
URL:https://www.dresden-science-calendar.de/calendar/de/detail/22668
LOCATION:TUD Materials Science - HAL\, Hallwachsstraße 301069 Dresden
SUMMARY:Karnaushenko: Microelectronics at mesoscale : Towards flexible and 
 3D biomedical devices
CLASS:PUBLIC
DESCRIPTION:Speaker: Daniil Karnaushenko\nInstitute of Speaker: Research Ce
 nter for Materials Architectures and Integration of Nanomembranes (MAIN)\,
  TU Chemnitz\nTopics:\nMaterialien\n Location:\n  Name: TUD Materials Scie
 nce - HAL (HAL Bürogebäude - 115)\n  Street: Hallwachsstraße 3\n  City:
  01069 Dresden\n  Phone: \n  Fax: \nDescription: Emerging materials and ad
 vanced manufacturing strategies are key enablers in the evolution of next-
 generation microelectronic architectures and sensing devices. In recent ye
 ars\, advanced fabrication techniques have been introduced that support th
 e development of flexible thin-foil systems and self-assembly processes ca
 pable of forming complex three-dimensional microstructures. These approach
 es are based on planar processing of carefully engineered material systems
 —including organic and inorganic\, rigid and soft materials—on convent
 ional wafer substrates. The resulting thin-foil systems are then delaminat
 ed in a controlled manner and induced to undergo deterministic shape trans
 formations such as folding\, buckling\, or rolling. For the first time sin
 ce the dawn of microelectronics\, electronic components can now move beyon
 d traditional two-dimensional fabrication constraints\, expanding into the
  third dimension via scalable\, monolithic\, wafer-level processes. These 
 ultra-lightweight systems\, often in the microgram range and only a few mi
 crometers thick\, offer previously unattainable benefits in terms of envir
 onmental sustainability and mechanical robustness. When combined with mode
 rn electronic fabrication methods\, they enable the seamless integration o
 f a wide array of miniature functionalities—including active circuits an
 d specialized sensors such as bio- and magnetic sensors. This development 
 paves the way for a new generation of electronically integrated\, miniatur
 ized instruments and sensors\, purpose-built for biomedical and environmen
 tal applications with high functional density and low ecological footprint
 .
DTSTAMP:20260922T121315Z
CREATED:20260213T051025Z
LAST-MODIFIED:20260408T053628Z
END:VEVENT
END:VCALENDAR